The Samsung Galaxy S8 device has been rumored to be a lot of things and packing diverse specs including an 8GB RAM which has raised brows since such chips are yet to hit the market. However, the doubts about the new Samsung’s flagship device sporting the 8 GB chip may have been doused as SK Hynix, the main memory-making competition of Samsung in Korea today announced its silicon-two 8 GB pieces which is stacked in four layers.
According to SK Hynix, the stacking combination takes up 30 percent less space compared to the LPDDR4 mobile chips. The company also reported that the new design boasts of a 20% increased power efficiency. The new mobile RAM modules which has since been dubbed the LPDDR4X is expected to go viral in the mobile market this year as more smartphone companies are looking to push the limit of what their devices offer.
Against SK Hynix’s tip that the RAM module will be in high demand from various mobile phone manufacturing companies, indications from other sources point that the Galaxy S8 and the iPhone 8 may be its principal users. However, it is harder to believe that Apple will partake of the 8 GB RAM module craze.
The Samsung Galaxy S8 is expected to pack a 5.1-inch screen with a Samsung Exynos chipset running under the hood while sporting an 8 GB RAM and up to 32GB of internal storage size.The smartphone is also expected to be fitted with a fingerprint scanner, a 12MP camera on the rear panel and an 8MP camera on the front panel all running on the latest Android Nougat OS release.